Yamagata University released on Oct, 18 that a new organization "Soft 3D Co Creation Consortium" working on basic research with industrials will be established. The university is going to do collaborative research on the field of "Soft 3D Interface" such as flexible semiconductor substrate aiming for commercialization in 10-20 years. 24 companies including Daikin Industries have decided to participate this organization, which will be a large-scale research organization that can use more than annual 200 million yen coming from both government and manufacturers.

Nikkei       Oct, 19, 2018       Friday